- President & Founder of ESPAT Group of Companies, Dresden, Germany: ESPAT-Consulting since 07/2019, and ESPAT-Design&Trading since 07/2024
- Most recently: Senior Manager, Pack4EU-Project @ SEMI Europe GmbH, Berlin Germany
- Until June 2019, worked for 22 years in different Semiconductor Packaging R&D, Engineering, and Management positions at large IDMs and OSATs in Germany and Portugal (Siemens, Infineon, Qimonda, NANIUM, and Amkor)
- In 2016 founded and since chaired or co-chaired the European SEMI-integrated Packaging, Assembly, and Test – Technology Community (ESiPAT-TC), a special interest group in SEMI focusing on manufacturing in Europe
- Authored or co-authored 23 patent filings and many technical papers in the field of Packaging Technology
- Co-edited two textbooks about “Embedded and Fan-Out Wafer and Panel Level Packaging Technologies”
- Active member of many technical and conference committees of IEEE EPS, SEMI, IMAPS, and SMTA
- IEEE EPS Program Director Region 8 (EMEA) and member of Bord of Governors
- Holds an M.Sc. in Electrical Engineering and Micro-systems Technologies from the Technical University of Chemnitz, Germany
