2004 Engineer of Microsystems Technology (HTW Berlin)
2004 – 2011 System developer / Technologist for sensor systems and Analog Electronics (ELBAU GmbH, later First Sensor AG, now TE Connectivity)
2011 – 2012 Senior development engineer for Advanced Packaging (Swissbit Germany AG)
2012 – 2015 Head of Process Engineering (Swissbit Germany AG)
2015 -2017 Head of Process Engineering & Product development (Swissbit Germany AG)
2017 – 2019 Global Director Engineering & Development (Swissbit Germany AG)
2019 – now General Manager APAT Solution / Manging Director Berlin Fab (APAT = Advanced Packaging & Test, Swissbit Germany AG)
Since 2020 Executive Director of Swissbit Germany AG (chairman of the board)
