Dr. Przemyslaw Gromala is a dynamic and results-driven professional with over two decades of leadership experience in electronic packaging and systems development. He is currently employed at Robert Bosch GmbH as an R&D Project Leader. With a proven track record of managing cross-functional teams and driving innovation, Przemyslaw has successfully executed strategic R&D initiatives through leading publicly funded projects. Since 2022, Przemyslaw has been leading the EPoSS Task Force Advanced Packaging, creating a network of electronic packaging experts in Europe,
Prior to joining Bosch, Dr. Gromala worked at Delphi in Krakow, as well as at Infineon in Dresden. He holds a PhD in mechanical engineering from Cracow University of Technology in Poland. Przemyslaw Gromala is a member of the IEEE EPS Board of Governors and serves as the Program Chair for the IEEE EPS 75th ECTC 2025 Conference.
